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Due to current electronics industry trends for products with compact size, it is an urgent issue for all the manufacturers to provide the products capable of effectively dissipating heat generated during operation.

In recent years, heat-dissipation issues for LED lighting and PCB substrate have been frequently discussed. There are various heat-dissipation materials and solutions available in the market. Heat-dissipation coatings might become the main stream solution because the thermal conductivity and thermal emissivity of the coated product are increased so that heat-dissipation effectiveness is achieved even under the application environment without forced air convection environment.

Heat-dissipation coatings are used to enhance the radiation cooling capability of the coated products. Through heat energy radiated from the coated product, the surface temperature of the coated product is reduced so as to achieve the purpose of cooling.